From Concept Ideation To Working Hardware.
Whether you need a custom multi-layer PCB, embedded firmware for high-reliability controllers, functional 3D printed enclosures, or a complete college robotics lab, EI House delivers dependable engineering solutions.
Professional Engineering Capabilities
Backed by physical bench test equipment, calibrated instruments, and experienced hardware engineers.
Multi-Layer PCB Design & DFM
Schematic capture, high-speed 2 to 6-layer PCB routing, impedance matching, thermal vias, and complete fabrication-ready Gerber/BOM packages using KiCad and Altium Designer.
Deliverables:
- Schematics & Netlists
- Fabrication Gerbers & Drill Files
- Pick & Place Centroid Files
- Interactive BOM & 3D STEP Models
Embedded Firmware & RTOS Development
Production-grade embedded C/C++ firmware for STM32, ESP32, Nordic nRF, and Microchip MCUs. FreeRTOS task architecture, peripheral drivers, bootloaders, and low-power sleep profiling.
Deliverables:
- Well-commented C/C++ Source Code
- Automated Unit Tests & CI Pipeline
- Hardware Abstraction Layer (HAL)
- Over-the-Air (OTA) Flash Firmware
Rapid 3D Prototyping & Enclosure Design
Parametric 3D CAD modeling, snap-fit PCB enclosures, functional prototypes printed in Carbon-Fiber PETG, ASA, or Nylon, and silicone molding preparation.
Deliverables:
- CAD Solid Models (.STEP / .IGES)
- High-Detail Functional Prototypes
- Dimensional Inspection & Fit Testing
- Manufacturing DFM Consultation
Turnkey IoT & Telemetry Hardware
End-to-end connected hardware solutions combining sensor telemetry, cellular/Wi-Fi/LoRa communication, battery optimization, and cloud ingestion via MQTT/HTTPS.
Deliverables:
- Custom IoT Sensor Node Hardware
- Cloud API & Webhook Integration
- Low-power Battery Lifetime Analysis
- Field Pilot Unit Deployment
College STEM & Robotics Innovation Labs
Complete turnkey setup of modern robotics, embedded systems, and IoT laboratories in educational institutions. Includes equipment, workstations, syllabus, and faculty training.
Deliverables:
- Full Workstation Layout & Bill of Quantities
- Curriculum & Step-by-Step Lab Manuals
- Faculty Development Programs (FDP)
- Official EI House Innovation Center Signage
Hardware Reverse Engineering & Consulting
Bill of Materials cost optimization, obsolescence replacement for legacy chips, schematic reconstruction, and regulatory EMC/EMI pre-compliance guidance.
Deliverables:
- Alternative Component Equivalents
- EMC Noise Mitigation Strategy
- Unit Production Cost Reductions
- Comprehensive Engineering Audit Report
Transparent Engineering Workflow
No hidden costs or unverified handoffs. Every stage includes design reviews and physical testing.
Feasibility & Architecture
Review specs, select silicon, and define pinout & power budgets.
Schematic & CAD Routing
Detailed schematic drafting, multi-layer routing, and 3D enclosure check.
Fabrication & Assembly
Physical PCB assembly, component soldering, and test bench bring-up.
Testing & Delivery
Firmware flashing, thermal & logic analysis, and complete source handover.